As one customer recently noted, other commercial systems can’t hold a candle to the stress/power level’s achieved by Reedholm Systems. For fast wafer level reliability testing, we developed failure mechanism specific test structures and the test algorithms needed to make them effective tools. We scale the structures to design rules for simple and complex processes.
For packaged structures or slow wafer level testing, we deliver the measurement precision of parametric test systems and guaranteed uniformity of stress. Sample sizes can be quite flexible and varied as needed for oxide, interconnect, gate soak, and transistor evaluations. Because we started in this field working with advanced semiconductor processing labs, test methods and quality of results are unequaled.
We are leveraging off the 10kV/50A systems implemented for SiC/GaN production test, and applying this learning to reliability requirements needed to ensure the reliability of power and standard WBG devices.
Integration services are available, as well as supply and characterization third party elements such as thermal systems, device interfaces, and the like, enabling us to provide turn-key systems with fully characterized performance that are ready for effective use on the day they are installed.