Reedholm has configured an integrated system, not just a set of boxes, for testing high power devices at the wafer level. Sophisticated testing, prober control, and database management do not carry a programming burden. As a result, fast, automated wafer testing is done in an inexpensive, compact probing platform.
A simple, rugged rectangular probe card interface eliminates the bulky and complicated test head that makes other testers expensive and difficult to maintain. The interface is compatible with high pressure probing that uses the Paschen relationship to reach high breakdown voltages without having to use Fluorinert.
Because the tester is based on a modern parametric tester, precise device measurements are possible, not just pass/fail or binning measurements. Crosspoint matrix connections increase the type and quality of measurements beyond what is feasible with three or four dedicated connections to cover:
• Bipolar, JFET, &MOSFET characteristics.
• High frequency (100kHz) capacitance.
• “Zero current” Rdson measurement.